Hybrid Circuits (105)

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Chapter Outline

Chapter 14 - Hybrid Circuits (Understanding Digital Electronics)

  • Hybrid Substrates—Thick Film Process
  • Thick Film Process
    • Resistors
    • Inductors
  • Thin-Film Process
    • Optical Mask and Substrate
    • Tracks and Resistors
    • Separated Tracks and Resistors
    • Laser Trim Resistors
  • Assembly Process
    • Die Attachment to Substrate
    • Wire Bonding
    • Tape Automated Bonding (TAB)
    • Flipped Chip—Solder Bumping
    • Flipped Chip/Flipped TAB
  • Packaging Process
    • Bare Die Encapsulated in Plastic 

Video Outline

Hybrid Circuits (ver. 104-5)